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To successfully solder surface mount components to a circuit board, the heat should be transferred to the solder alloy paste until its temperature reaches a molten point (217°C for SAC305 lead free solder). The liquid alloy will merge with PCB copper pads and become a eutectic alloy mixture. A solid solder joint will be formed after it cools down below molten point.
The modern solder reflow oven use the concepts of radiation and convection combined. Hheat is emitted by ceramic heat element with infrared radiation, but it doesn’t deliver it to a PCB directly. The heat will transfer to a heat regulator first to make heat output even. A convection fan will blow the hot air to an inner chamber. The target PCB can will get heat consistency in any spot.
QISMT Electronic Co.,ltd provide a full SMT assembly line solutions, including SMT Reflow Oven, Wave Soldering Machine, Pick and Place Machine, Insert Plug-in machine, SMT Stencil Printer, SMT AOI SPI Machine, SMT Peripheral Equipment, SMT Production line, SMT Spare Parts etc any kind SMT machines you may need, pleasecontact us for more information: wechat whatsapp:+8617748683433, Skype: qismteric, Email: firstname.lastname@example.org
Phone: +86 17748683433
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