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In most situations, the thermal setpoints of a reflow oven are the same for both the Top and Bottom heating elements in the same zone. But there are special cases where it is necessary to apply different temperature settings to the TOP and BOTTOM elements. The SMT process engineer should review the specific board requirements to determine the correct settings. In general, here are some guidelines for setting heating element temperatures:
Finally, the process engineer must check and optimize the thermal profile for every particular board. Quality engineers should also involved in order to inspect the solder joint. An x-ray inspection machine may be utilized for further analysis.
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